铜铝复合板界面组织和性能研究

路王珂; 谢敬佩; 王爱琴; 王文焱; 张银娣

doi:10.15980/j.tzzz.2014.02.011

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铜铝复合板界面组织和性能研究
Bonding Interface Structure and Properties of Copper and Aluminum Composite Plate
2014年34卷第2期页码：198-200
纸质出版日期： 2014 ，
DOI： 10.15980/j.tzzz.2014.02.011

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[1]路王珂,谢敬佩,王爱琴,王文焱,张银娣.铜铝复合板界面组织和性能研究[J].特种铸造及有色合金,2014,34(02):198-200.

Lu Wangke, Xie Jingpei, Wang Aiqin, et al. Bonding Interface Structure and Properties of Copper and Aluminum Composite Plate[J]. Special Casting & Nonferrous Alloys, 2014,34(2):198-200.
[1]路王珂,谢敬佩,王爱琴,王文焱,张银娣.铜铝复合板界面组织和性能研究[J].特种铸造及有色合金,2014,34(02):198-200. DOI： 10.15980/j.tzzz.2014.02.011.

Lu Wangke, Xie Jingpei, Wang Aiqin, et al. Bonding Interface Structure and Properties of Copper and Aluminum Composite Plate[J]. Special Casting & Nonferrous Alloys, 2014,34(2):198-200. DOI： 10.15980/j.tzzz.2014.02.011.

摘要

对固-液法制备的铜铝复合板进行不同工艺的轧制并进行300℃×4h退火处理

测定了复合板的抗拉强度、伸长率、界面剥离强度及电导率

利用金相显微镜和扫描电镜等分析了结合界面的组织形貌

研究了轧制及退火工艺对结合界面扩散层组织和复合板性能的影响。结果表明

轧制后形成的CuAl2相降低了复合板的剥离强度和电导率

退火处理可促进结合界面原子互扩散形成Cu9Al4

改善复合板的性能

同时电导率也得以提高。

Abstract

Copper and aluminum composite plate fabricated by solid-liquid bonding method was rolled in different processes and then annealed at 300℃for 4h.The tensile strength

elongation

interface peel strength and conductivity were tested

and structure of interface was analyzed with the help of optical microscope and scanning electron microscopy to understand effects of rolling and annealing treatment on microstructure and properties of bonding interface diffusion layer.The results show that CuAl2phase formed after rolling can weaken the peel strength and conductivity

however

with annealing treatment

the mutual diffusion of atoms in bonding interface is promoted to form Cu9Al4 phase

improving the performance and electric conductivity of composite plate.