Chen Da, Chen Yiqing, Xu Guangchen, et al. Behavior of Compound Interface of ZL109/Q235 by Liquid-Solid Bonding Process[J]. Special Casting & Nonferrous Alloys, 2013,33(7):665-668.
Chen Da, Chen Yiqing, Xu Guangchen, et al. Behavior of Compound Interface of ZL109/Q235 by Liquid-Solid Bonding Process[J]. Special Casting & Nonferrous Alloys, 2013,33(7):665-668. DOI: 10.15980/j.tzzz.2013.07.010.
Effects of carbon steel surface treatment and pre-heating temperature on solid-liquid compound interface structure and performance of the Q235 / ZL109 were investigated. The results show that the surface wettability of ZL109/Q235 can be effectively improved by the surface treatment on the Q235 steel substrate. The Ni-Cu plating surface treatment can significantly improve the wettability of the bi-metallic samples and prevent from the secondary oxidation. The compound interface of the Q235 (700 ℃)/ZL109 (730 ℃) exhibits metallurgical bonding
which is composed of FeAl3
Fe2Al5 intermetallic compounds
and the thickness of bonding layer can be controlled in range of 15 μm to 28 μm
significantly improving the shear strength of compound interface.