Cu粉粒径对W-40Cu合金伪半固态挤压铸造件性能的影响

纪兴华; 程远胜; 尚翠霞; 许春平; 孙召瑞

doi:10.15980/j.tzzz.2013.02.024

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Cu粉粒径对W-40Cu合金伪半固态挤压铸造件性能的影响
Effect of Copper Particle Size on Properties of W-40Cu Alloy Parts Prepared by Thixo-die-forging in Pseudo-semi-solid State
2013年33卷第2期页码：101-103
纸质出版日期： 2013 ，
DOI： 10.15980/j.tzzz.2013.02.024

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[1]纪兴华,程远胜,尚翠霞,许春平,孙召瑞.Cu粉粒径对W-40Cu合金伪半固态挤压铸造件性能的影响[J].特种铸造及有色合金,2013,33(02):101-103.

Ji Xinghua1, Cheng Yuansheng2, Shang Cuixia1, et al. Effect of Copper Particle Size on Properties of W-40Cu Alloy Parts Prepared by Thixo-die-forging in Pseudo-semi-solid State[J]. Special Casting & Nonferrous Alloys, 2013,33(2):101-103.
[1]纪兴华,程远胜,尚翠霞,许春平,孙召瑞.Cu粉粒径对W-40Cu合金伪半固态挤压铸造件性能的影响[J].特种铸造及有色合金,2013,33(02):101-103. DOI： 10.15980/j.tzzz.2013.02.024.

Ji Xinghua1, Cheng Yuansheng2, Shang Cuixia1, et al. Effect of Copper Particle Size on Properties of W-40Cu Alloy Parts Prepared by Thixo-die-forging in Pseudo-semi-solid State[J]. Special Casting & Nonferrous Alloys, 2013,33(2):101-103. DOI： 10.15980/j.tzzz.2013.02.024.

摘要

采用粒径为10、25、40μm的金属Cu粉与平均粒度为3μm的W粉

通过伪半固态触变挤压铸造制备了W-40Cu合金筒形件。结果表明

在加热温度为1350℃、挤压力为500MPa的条件下

减小Cu粉粒径有利于触变挤压铸造成形件力学性能的提高;Cu粉粒径越细

成形件导电性能越好。

Abstract

Thixo-die-forging process in pseudo-semi-solid state was used to prepare W-40Cu cup shell with copper particle size in 10μm

25μm

40μm and tungsten particle size in 3μm.The results show that with the heating temperature of 1 350℃and applied pressure of 500MPa

the decrease of copper particle size is favorable for the improvement of mechanical properties of thixoforged parts.With the copper particle size decrease

conductive properties of thixoforged parts are increased.

关键词

W-Cu合金伪半固态触变挤压铸造成形导电性能

Keywords

W-Cu AlloyPseudo-semi-solid Thixo-die-forgingConductive Properties

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