时效Sn-0.3Ag-0.7Cu/OSP、ENIG焊点剪切强度的比较

戴宗倍; 卫国强; 薛明阳; 师磊

doi:10.15980/j.tzzz.2012.12.029

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时效Sn-0.3Ag-0.7Cu/OSP、ENIG焊点剪切强度的比较
Comparative Analysis of Shear Strength of Sn-0.3Ag-0.7Cu/OSP、ENIG Solder Joints under Aging Conditions
2012年32卷第12期页码：1155-1158
纸质出版日期： 2012 ，
DOI： 10.15980/j.tzzz.2012.12.029

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[1]戴宗倍,卫国强,薛明阳,师磊.时效Sn-0.3Ag-0.7Cu/OSP、ENIG焊点剪切强度的比较[J].特种铸造及有色合金,2012,32(12):1155-1158.

Dai Zongbei, Wei Guoqiang, Xue Mingyang, et al. Comparative Analysis of Shear Strength of Sn-0.3Ag-0.7Cu/OSP、ENIG Solder Joints under Aging Conditions[J]. Special Casting & Nonferrous Alloys, 2012,32(12):1155-1158.
[1]戴宗倍,卫国强,薛明阳,师磊.时效Sn-0.3Ag-0.7Cu/OSP、ENIG焊点剪切强度的比较[J].特种铸造及有色合金,2012,32(12):1155-1158. DOI： 10.15980/j.tzzz.2012.12.029.

Dai Zongbei, Wei Guoqiang, Xue Mingyang, et al. Comparative Analysis of Shear Strength of Sn-0.3Ag-0.7Cu/OSP、ENIG Solder Joints under Aging Conditions[J]. Special Casting & Nonferrous Alloys, 2012,32(12):1155-1158. DOI： 10.15980/j.tzzz.2012.12.029.

摘要

研究了Sn-0.3Ag-0.7Cu钎料与有机防氧化涂层（OSP）及化学镀镍金镀层（ENIG）焊盘回流焊后焊点界面IMC和剪切强度在不同时效条件下的变化。结果表明

（1）随着时效时间的增加

两种焊盘的界面IMC厚度都增加

并且符合抛物线生长规律

但是OSP焊盘界面IMC生长速率要快于ENIG焊盘界面IMC的生长速率

其界面IMC的形貌逐渐平整;（2）OSP和ENIG焊盘焊点的剪切强度均随时效时间的延长而下降。在低温时效时

ENIG焊盘焊点的剪切强度高于OSP焊盘焊点的剪切强度;然而

在高温时效时

ENIG焊盘焊点的剪切强度却低于OSP焊盘焊点的剪切强度。

Abstract

Changes of the interfacial IMC（intermetallic compound）morphologies and the shear strength of Sn-0.3Ag-0.7Cu/OSP

ENIG finishes solder joints were evaluated under different aging conditions.The results indicate that:（1）The interfacial IMC thickness between the two type of finishes and Sn-0.3Ag-0.7Cu solder is increased with increasing in aging time

and the growth rule follows parabolic rule.However

the growth rate of the interfacial IMC with OSP finish is higher than with ENIG finish

and the IMC morphologies gradually transform into the flat wave-shaped.（2）The shear strength of Sn-0.3Ag-0.7Cu/OSP

ENIG finishes solder joints is decreased with increasing in aging time.With aging at lower temperature

the shear strength of the solder joint with ENIG finish is higher than that with OSP finish.However

the shear strength of the solder joint with ENIG finish is lower than that with OSP finish with aging at higher temperature.

关键词

Sn-0.3Ag-0.7Cu钎料OSPENIG时效IMC形貌剪切强度

Keywords

Sn-0.3Ag-0.7Cu SolderOSPENIGAgingIMC MorphologyShear Strength

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