高强铜/钢双金属复合导板的界面结合机制

张平; 张元好; 常庆明

doi:10.15980/j.tzzz.2012.08.010

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高强铜/钢双金属复合导板的界面结合机制
Bonding Mechanism of the High Strength Copper/Steel Bimetal Interface of Composite Guide Plate
2012年32卷第8期页码：768-770
纸质出版日期： 2012 ，
DOI： 10.15980/j.tzzz.2012.08.010

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[1]张平,张元好,常庆明.高强铜/钢双金属复合导板的界面结合机制[J].特种铸造及有色合金,2012,32(08):768-770.

Zhang Ping1, Zhang Yuanhao2, Chang Qingming1. Bonding Mechanism of the High Strength Copper/Steel Bimetal Interface of Composite Guide Plate[J]. Special Casting & Nonferrous Alloys, 2012,32(8):768-770.
[1]张平,张元好,常庆明.高强铜/钢双金属复合导板的界面结合机制[J].特种铸造及有色合金,2012,32(08):768-770. DOI： 10.15980/j.tzzz.2012.08.010.

Zhang Ping1, Zhang Yuanhao2, Chang Qingming1. Bonding Mechanism of the High Strength Copper/Steel Bimetal Interface of Composite Guide Plate[J]. Special Casting & Nonferrous Alloys, 2012,32(8):768-770. DOI： 10.15980/j.tzzz.2012.08.010.

摘要

采用液态铜与钢复合、液态钢与铜复合两种方案制取了高强铜/钢双金属复合导板。对高强铜/钢双金属复合导板的界面处显微组织、元素分布进行了分析。结果表明

两种复合方式均可使高强铜/钢实现良好的冶金结合;在高强铜/钢双金属的复合过程中

原子优先沿金属表面扩散和晶间渗透

晶界是扩散的主要通道;高强铜/钢双金属界面结合主要通过表面润湿铺展和原子扩散导致富Fe和富Cu区形成Fe-Cu合金相等作用来共同实现。

Abstract

The high-strength copper/steel bimetal composite guide plates were produced by using two kinds of method such as liquid copper and steel casting cladding

liquid steel and copper casting cladding.The interface characteristics of the composite guide plate prepared was analyzed by observing the microstructures and measuring the elements distribution.The results show that desirable metallurgical bonding can be obtained at the copper/steel interface by the two methods.Atoms in high-strength copper/steel bimetal are preferential to diffusion along the metal surface and intergranular infiltration in composite process

and the main diffusion channel is grain boundary.The interfacial bonding of high-strength copper/steel bimetal can be achieved as a result of formation of Fe-Cu alloy phase in the Fe-rich and Cu-rich areas by surface wet-spread and atoms diffusion.