等温时效对SnAgCu焊点界面组织及剪切强度的影响

王磊; 卫国强; 薛明阳; 姚健

doi:10.15980/j.tzzz.2012.07.019

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等温时效对SnAgCu焊点界面组织及剪切强度的影响
Effects of Isothermal Aging on Interfacial Intermetallic Compound（IMC）and Shear Strength of Lead-free SnAgCu Solder Joints
2012年32卷第7期页码：677-680
纸质出版日期： 2012 ，
DOI： 10.15980/j.tzzz.2012.07.019

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[1]王磊,卫国强,薛明阳,姚健.等温时效对SnAgCu焊点界面组织及剪切强度的影响[J].特种铸造及有色合金,2012,32(07):677-680.

Wang Lei, Wei Guoqiang, Xue Mingyang, et al. Effects of Isothermal Aging on Interfacial Intermetallic Compound（IMC）and Shear Strength of Lead-free SnAgCu Solder Joints[J]. Special Casting & Nonferrous Alloys, 2012,32(7):677-680.
[1]王磊,卫国强,薛明阳,姚健.等温时效对SnAgCu焊点界面组织及剪切强度的影响[J].特种铸造及有色合金,2012,32(07):677-680. DOI： 10.15980/j.tzzz.2012.07.019.

Wang Lei, Wei Guoqiang, Xue Mingyang, et al. Effects of Isothermal Aging on Interfacial Intermetallic Compound（IMC）and Shear Strength of Lead-free SnAgCu Solder Joints[J]. Special Casting & Nonferrous Alloys, 2012,32(7):677-680. DOI： 10.15980/j.tzzz.2012.07.019.

摘要

研究了Sn-3.0Ag-0.5Cu/Cu焊点分别在1、5、10min焊接时间后在373、403、438K时效温度下焊点界面IMC的生长和剪切强度随时效时间的变化

同时对焊点断口形貌及断裂模式进行了分析。结果表明

焊接时间越长

界面IMC层越厚。随着时效时间的延长

界面IMC不断增厚

其生长动力学符合抛物线生长规律

生长激活能为75.03kJ/mol;焊点剪切强度随时效时间增加不断下降

其断裂方式从开始的韧性断裂逐渐转变为局部脆性断裂。

Abstract

Growth of the interfacial intermetallic compound（IMC） and the evolution of shear strength of the Sn-3.0Ag-0.5Cu/Cu joints with welding for 1

10 min and aging at 373

403

438 K

respectively

were investigated by optical microscope（OM） and SEM（scanning electron microscope）.Meanwhile

fracture morphology and fracture mode of the solder joints were also analyzed.The results show that with the increase of welding time

the thickness of the IMC layer is increased.With increasing in aging time

IMC thickens is increased

and its growth dynamics follows a parabolic growth pattern

and the growth activation energy is 75.03 kJ/mol.The shear strength of solder joints is decreased with extending in aging time.The fracture mode is transformed from the ductile fracture into local brittle fracture gradually.