Ni-Cu-P合金显微组织和硬度的研究

陈平昌; 林汉同

doi:10.15980/j.tzzz.2000.05.010

浏览量 : 0 下载量: 78 CSCD: 1

导出
分享
收藏
专辑

Ni-Cu-P合金显微组织和硬度的研究
Study on Microstructure and Hardness of Ni-Cu-P Alloy
2000年第5期页码：23-24
纸质出版日期： 2000 ，
DOI： 10.15980/j.tzzz.2000.05.010

扫描看全文

[1]陈平昌,林汉同.Ni-Cu-P合金显微组织和硬度的研究[J].特种铸造及有色合金,2000(05):23-24+2.

Chen Pingchang. Study on Microstructure and Hardness of Ni-Cu-P Alloy[J]. Special Casting & Nonferrous Alloys, 2000,(5):23-24.
[1]陈平昌,林汉同.Ni-Cu-P合金显微组织和硬度的研究[J].特种铸造及有色合金,2000(05):23-24+2. DOI： 10.15980/j.tzzz.2000.05.010.

Chen Pingchang. Study on Microstructure and Hardness of Ni-Cu-P Alloy[J]. Special Casting & Nonferrous Alloys, 2000,(5):23-24. DOI： 10.15980/j.tzzz.2000.05.010.

摘要

熔制的Ni Cu P合金显微组织由Ni Cu

Cu Ni两种固溶体枝晶和弥散其中的Ni3P组成。随着磷含量的增加

Ni Cu P合金的硬度显著提高。热处理对Ni Cu P合金的显微组织和硬度无显著影响

Abstract

Microstructure of smelting prepared Ni Cu P alloy consists of Ni Cu and Cu Ni solid solution dendrites and Ni 3P dispersed particles between them. The hardness of Ni Cu P alloy is raised remarkably with the increase of P addition. Heat treatment has no obvious effect on microstructure and hardness of Ni Cu P alloy.