Cu-3.2 Ni-0.75 Si alloy was prepared by twin-roll strip casting（TRSC）. The effects of solution temperature on microstructure

electrical conductivity

microhardness and element segregation behavior of the alloy were investigated. The results indicate that the microstructure of the alloy is gradually recovered

recrystallized

and recrystallized grains grow up with the increase of solution temperature. As the solution temperature increases

the microhardness is decreased and electrical conductivity is firstly decreased and then increased. After solution at 900 ℃ for 1 h

Ni and Si are completely dissolved into Cu matrix

forming a single α-Cu solid solution

where the microhardness and electrical conductivity of the alloy are 67.2 HV and 9.338 MS/m

respectively.