The surface of SiC

p

was coated with Cu by electroless plating method. Taking 2024 Al alloy as the matrix

60%SiC

p

/Al-matrix composites were prepared by direct-heating powder thixoforming process

and the effects of Cu coating on the microstructure

phase composition

fracture behavior

flexural strength and thermal expansion coefficient of composite were investigated. The results indicate that after Cu plating

the matrix of the composite is composed of intermetallic compounds dominated by AlCu and Al

2

Cu

which has a greater impact on the properties and performance of the composites. The thermal expansion coefficient is significantly reduced due to the appearance of new phases AlCu and Al

2

Cu in the matrix. Compared with the SiC

p

/2024 Al composite without copper plating

the relative densities of the material after copper plating are 99.15%

which is increased by 1.57%. The coefficients of thermal expansion are 5.73×10

-6

K

-1

which is reduced by 32.4%. The flexural strength are 283 MPa

which is reduced by 10.2%.