电场作用下Cu/Sn/Cu扩散偶的界面扩散行为

孟祥瑞; 高秉阳; 曹志强

doi:10.15980/j.tzzz.2021.09.009

研究·合金性能 | 浏览量 : 0 下载量: 25 CSCD: 0

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电场作用下Cu/Sn/Cu扩散偶的界面扩散行为
Interfacial Diffusion Behavior of Cu/Sn/Cu Diffusion Couples under Electric Field
2021年41卷第9期页码：1102-1108
纸质出版日期： 2021 ，
DOI： 10.15980/j.tzzz.2021.09.009

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孟祥瑞, 高秉阳, 曹志强. 电场作用下Cu/Sn/Cu扩散偶的界面扩散行为[J]. 特种铸造及有色合金杂志, 2021,41(9):1102-1108.

Meng Xiangrui, Gao Bingyang, Cao Zhiqiang. Interfacial Diffusion Behavior of Cu/Sn/Cu Diffusion Couples under Electric Field[J]. Special Casting & Nonferrous Alloys, 2021,41(9):1102-1108.
孟祥瑞, 高秉阳, 曹志强. 电场作用下Cu/Sn/Cu扩散偶的界面扩散行为[J]. 特种铸造及有色合金杂志, 2021,41(9):1102-1108. DOI： 10.15980/j.tzzz.2021.09.009.

Meng Xiangrui, Gao Bingyang, Cao Zhiqiang. Interfacial Diffusion Behavior of Cu/Sn/Cu Diffusion Couples under Electric Field[J]. Special Casting & Nonferrous Alloys, 2021,41(9):1102-1108. DOI： 10.15980/j.tzzz.2021.09.009.

摘要

利用同步辐射X射线研究了电场作用下Cu/Sn/Cu扩散偶的界面扩散行为及微观组织演变。分别在无电流、双向脉冲电流和直流电流作用下探究了Cu

的生长动力学。结果发现

双向脉冲电场可以显著抑制Sn/Cu界面Cu

的生长

迫使Cu

在Sn焊料中以板条状析出。而直流电场可以有效促使Cu/Sn/Cu扩散偶中的Cu

从阳极向阴极方向生长。

Abstract

The interfacial diffusion behavior and microstructure evolution of Cu/Sn/Cu diffusion couple under electric field were in-situ observed by synchrotron radiation X-ray. The growth kinetics of Cu

was in-situ investigated under absence of current

bidirectional pulse current and direct current

respectively. The results indicate that the growth of Cu

at the Sn/Cu interface is significantly inhibited by the bidirectional pulsed electric field

which forces the precipitation of Cu

in the Sn solder in form of plates.DC field can effectively promote the growth of Cu

in Cu/Sn/Cu diffusion pairs accidentally from anode to cathode.

关键词

同步辐射X射线原位观测生长动力学电场作用

Keywords

Synchrotron X-ray RadiographyIn-situ ObservationGrowth KineticsElectric Field Action

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