Sn-1.0Ag-0.5Cu-0.06Sm无铅钎料的蠕变性能研究

张春红; 张宁; 耿德英

doi:10.15980/j.tzzz.2020.11.029

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Sn-1.0Ag-0.5Cu-0.06Sm无铅钎料的蠕变性能研究
Creep Behavior of Sn-1.0Ag-0.5Cu-0.06Sm Lead-free Solder
2020年40卷第11期页码：1302-1306
纸质出版日期： 2020 ，
DOI： 10.15980/j.tzzz.2020.11.029

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[1]张春红,张宁,耿德英.Sn-1.0Ag-0.5Cu-0.06Sm无铅钎料的蠕变性能研究[J].特种铸造及有色合金,2020,40(11):1302-1306.

Zhang Chunhong, Zhang Ning, Geng Deying. Creep Behavior of Sn-1.0Ag-0.5Cu-0.06Sm Lead-free Solder[J]. Special Casting & Nonferrous Alloys, 2020,40(11):1302-1306.
[1]张春红,张宁,耿德英.Sn-1.0Ag-0.5Cu-0.06Sm无铅钎料的蠕变性能研究[J].特种铸造及有色合金,2020,40(11):1302-1306. DOI： 10.15980/j.tzzz.2020.11.029.

Zhang Chunhong, Zhang Ning, Geng Deying. Creep Behavior of Sn-1.0Ag-0.5Cu-0.06Sm Lead-free Solder[J]. Special Casting & Nonferrous Alloys, 2020,40(11):1302-1306. DOI： 10.15980/j.tzzz.2020.11.029.

摘要

通过机械混合法制备了Sn-1.0Ag-0.5Cu-0.06Sm无铅复合钎料

采用SEM、EDS以及结合强度测试仪研究了蠕变对Cu/Sn1.0Ag0.5Cu-0.06Sm/Cu焊点的基体组织、界面形貌和力学性能的影响。结果表明

在长时间的高温蠕变作用下

焊点基体组织中不断析出Ag

Sn相和Cu

相

且合并长大聚集粗化;IMC层的形貌从回流态时的扇贝状不断生长为较为平直的宽厚层状

由Cu

单相转变为Cu

和Cu

Sn两相

这导致焊点的抗拉强度比回流态时下降了21.3%。

Abstract

Sn-1.0 Ag-0.5 Cu-0.06 Sm lead-free composite solders were prepared by mechanically mixing method. The effects of creep on the matrix microstructure and interface morphology as well as mechanical properties of Cu/Sn-1.0 Ag-0.5 Cu-0.06 Sm/Cu solder joints were investigated by SEM

EDS and bond strength tester. The results reveal that under the action of long-term high temperature creep

Sn and Cu

phases can be continuously precipitated in the matrix structure of the solder joints

which is merged

grown and aggregated. The morphology of the IMC layer continuously is grown from a scallop shape in the reflow state to a relatively flat and thick layer

and transformed from Cu

single phase to two phases of Cu

and Cu

resulting in decrease of 21.3% in the tensile strength of the solder joint compared with that of the reflux state.