In order to improve interfaces bonding between the TiB

2

particles and copper matrix

a new process of electroless copper plating on the TiB

2

was put forward.The plating efficiencies of TiB

2

were observed by SEM

and the relative densities

electric conductivities and thermal expansion properties of TiB

2

/Cu composites containing different volume fraction of TiB

2

before and afetr coated copper fabricated by microwave sintering were investigated.The results show that the electrical conductivities and thermal expansivity properties of the samples with coated copper TiB

2

are obviously superior to those of ones without coated TiB

2

however

the relative density of the former is obviously lower than that of the later due to the characteristics of microwave sintering.The results of theoretical calculation reveal that the CTE of the TiB

2

/Cu composites without plating copper TiB

2

is consistent with ROM model calculation value

while the CTE of the TiB

2

/Cu composites with plating copper TiB

2

is consistent with Kerner model calculation value

which indicate that the interface of the TiB

2

particles and the matrix is improved greatly after the TiB

2

particles modified with plating copper.