成形工艺对AuSn20共晶钎料薄带组织与性能的影响

刘生发; 陈柱; 刘俐; 熊杰然; 熊文勇; 胡哲兵; 陈晨; 黄尚宇

doi:10.15980/j.tzzz.2018.07.005

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成形工艺对AuSn20共晶钎料薄带组织与性能的影响
Effects of Forming Process on Microstructure and Properties of AuSn20 Eutectic Solder Ribbons
2018年38卷第7期页码：712-716
纸质出版日期： 2018 ，
DOI： 10.15980/j.tzzz.2018.07.005

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[1]刘生发,陈柱,刘俐,熊杰然,熊文勇,胡哲兵,陈晨,黄尚宇.成形工艺对AuSn20共晶钎料薄带组织与性能的影响[J].特种铸造及有色合金,2018,38(07):712-716.

Liu Shengfa, Chen Zhu, Liu Li, et al. Effects of Forming Process on Microstructure and Properties of AuSn20 Eutectic Solder Ribbons[J]. Special Casting & Nonferrous Alloys, 2018,38(7):712-716.
[1]刘生发,陈柱,刘俐,熊杰然,熊文勇,胡哲兵,陈晨,黄尚宇.成形工艺对AuSn20共晶钎料薄带组织与性能的影响[J].特种铸造及有色合金,2018,38(07):712-716. DOI： 10.15980/j.tzzz.2018.07.005.

Liu Shengfa, Chen Zhu, Liu Li, et al. Effects of Forming Process on Microstructure and Properties of AuSn20 Eutectic Solder Ribbons[J]. Special Casting & Nonferrous Alloys, 2018,38(7):712-716. DOI： 10.15980/j.tzzz.2018.07.005.

摘要

采用普通凝固-轧制工艺和快速凝固-轧制工艺制备了两种AuSn20共晶合金钎料薄带

借助OM、FESEM、XRD、EPMA、EDS、DSC和MTS陶瓷试验系统

比较了其显微组织、物相组成、成分分布、熔化特性和剪切强度。结果表明

相对于普通凝固-轧制工艺

快速凝固-轧制工艺制备的AuSn20共晶合金钎料薄带组织细小、成分均匀

固相线温度和液相线温度分别降低了4.9℃和7.4℃

熔化区间减小2.5℃

润湿性和剪切强度分别提高了10.96%和19.02%。

Abstract

Two kinds of AuSn20 eutectic alloy solder ribbons were prepared by a common casting-rolling process and a rapid solidification-rolling process.The microstructure

phase constitution

composition distribution

melting characteristics and soldering strength of the AuSn20 alloys prepared were analyzed comparatively using optical microscopy

scanning electron microscopy

X-ray diffraction

energy dispersive spectroscopy

differential scanning calorimetry and a MTS ceramic testing system.The results show that the microstructure of AuSn20 eutectic alloy solder ribbons prepared by a rapid solidification-rolling process presents finer and more uniform compared with that of ones by common casting-rolling process.The solidus and liquidus are reduced by 4.9 ℃ and 7.4 ℃

respectively

and the melting range is narrowed by 2.5 ℃.In addition

the wettability and shear strength of the solder joints are increased by10.96% and 19.02%

respectively.