退火工艺对快速凝固Au-20Sn钎料组织与性能的影响

刘生发; 熊文勇; 熊杰然; 胡哲兵; 陈柱; 陈晨; 黄尚宇

doi:10.15980/j.tzzz.2018.06.008

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退火工艺对快速凝固Au-20Sn钎料组织与性能的影响
Effects of Annealing Process on Microstructure and Properties of Rapidly Solidified Au-20Sn Solder
2018年38卷第6期页码：608-611
纸质出版日期： 2018 ，
DOI： 10.15980/j.tzzz.2018.06.008

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[1]刘生发,熊文勇,熊杰然,胡哲兵,陈柱,陈晨,黄尚宇.退火工艺对快速凝固Au-20Sn钎料组织与性能的影响[J].特种铸造及有色合金,2018,38(06):608-611.

Liu Shengfa, Xiong Wenyong, Xiong Jieran, et al. Effects of Annealing Process on Microstructure and Properties of Rapidly Solidified Au-20Sn Solder[J]. Special Casting & Nonferrous Alloys, 2018,38(6):608-611.
[1]刘生发,熊文勇,熊杰然,胡哲兵,陈柱,陈晨,黄尚宇.退火工艺对快速凝固Au-20Sn钎料组织与性能的影响[J].特种铸造及有色合金,2018,38(06):608-611. DOI： 10.15980/j.tzzz.2018.06.008.

Liu Shengfa, Xiong Wenyong, Xiong Jieran, et al. Effects of Annealing Process on Microstructure and Properties of Rapidly Solidified Au-20Sn Solder[J]. Special Casting & Nonferrous Alloys, 2018,38(6):608-611. DOI： 10.15980/j.tzzz.2018.06.008.

摘要

采用单辊快速凝固技术制备了Au-20Sn钎料薄带

借助FESEM、EPMA和EDS等测试手段

研究退火工艺对快速凝固Au-20Sn钎料合金组织与性能的影响。结果表明

单辊快速凝固Au-20Sn钎料合金由少量树枝状的初生ζ′-Au

Sn相和共晶组织（ζ′-Au

Sn+δ-AuSn）组成

显微组织细小。退火过程中

Sn元素从ζ′-Au

Sn相中向δ-AuSn相中扩散

δ-AuSn相长大。基于钎料薄带显微组织、成分分布和塑性综合考虑

确定退火工艺为240℃×4h。

Abstract

Au-20 Sn solder ribbon was prepared by single-roller rapid solidification technology.The effects of annealing process on microstructure and properties of rapidly solidified Au-20 Sn solder alloy were characterized by FESEM

EPMA and EDS.The results show that the single-roller rapidly solidified Au-20 Sn solder alloy consists of a small amount of primaryζ′-Au5 Sn dendrites and eutectic structure（ζ′-Au5 Sn+δ-AuSn）

and the microstructure is refined.During the annealing treatment

theδ-AuSn phase grows gradually because Sn element is diffused into theδ-AuSn phase from theζ′-Au5 Sn phase.Based on considering the microstructure

composition distribution and toughness

the annealing process is determined to be at 240 ℃for 4 h.