The microstructure and phase composition of Cu/Al composite interface were analyzed by scanning electron microscopy（SEM）and energy dispersive spectroscopy（EDS）for Cu/Al composite conductive head prepared by solid-liquid composite method.The shearing bond strength

microhardness

interfacial conductivity and corrosion resistance of the Cu/Al composite interface were expounded by means of shearing test

microhardness test

eddy current conductivity meter and electrochemical tests.The results reveal that the interface of Cu/Al composite interface is composed of a mixture of a large number of intermetallic compounds and the Al matrix

and the average width of the interfacial transition layer reaches approximately 500μm

in which there exists uneven distribution and large size Hole-like defects and small cracks

so interface bonding strength is only 6

1

0 MPa.In addition

corrosion resistance and electric behavior exhibit poor.The comparison of the microstructure and properties of the Cu/Al interface before and after the use of the conductive head shows that the main failure mechanism of the interface of the aluminum-clad conductive head is attributed to the large number of defects in the interface and the thick interface layer.When power is on

the electric resistance heats up severely

which further deteriorates the interface and eventually leads to failure.