预热温度对自蔓延TiC/Ni功能梯度涂层的影响

潘成刚; 冯斯琦; 赵川翔; 常庆明

doi:10.15980/j.tzzz.2017.11.003

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预热温度对自蔓延TiC/Ni功能梯度涂层的影响
Influence of Preheating Temperature on TiC/Ni Functionally Gradient Coating by SHS
2017年37卷第11期页码：1170-1175
纸质出版日期： 2017 ，
DOI： 10.15980/j.tzzz.2017.11.003

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[1]潘成刚,冯斯琦,赵川翔,常庆明.预热温度对自蔓延TiC/Ni功能梯度涂层的影响[J].特种铸造及有色合金,2017,37(11):1170-1175.

Pan Chenggang, Feng Siqi, Zhao Chuanxiang, et al. Influence of Preheating Temperature on TiC/Ni Functionally Gradient Coating by SHS[J]. Special Casting & Nonferrous Alloys, 2017,37(11):1170-1175.
[1]潘成刚,冯斯琦,赵川翔,常庆明.预热温度对自蔓延TiC/Ni功能梯度涂层的影响[J].特种铸造及有色合金,2017,37(11):1170-1175. DOI： 10.15980/j.tzzz.2017.11.003.

Pan Chenggang, Feng Siqi, Zhao Chuanxiang, et al. Influence of Preheating Temperature on TiC/Ni Functionally Gradient Coating by SHS[J]. Special Casting & Nonferrous Alloys, 2017,37(11):1170-1175. DOI： 10.15980/j.tzzz.2017.11.003.

摘要

为了研究预热温度对TiC/Ni功能梯度涂层的影响

利用自蔓延高温合成结合准热等静压技术（SHS/PHIP）

在H13钢表面制备了TiC/Ni梯度功能涂层

采用XRD和SEM-EDS对涂层的物相结构进行分析

采用显微硬度计测定涂层的表面硬度及界面结合性能。结果表明

涂层的主要物相为颗粒状TiC和包裹在TiC周围的Ni基固溶体;涂层为多孔骨架结构;随着预热温度升高

涂层表面孔隙率降低

致密度、TiC晶粒尺寸和表面硬度值增大

涂层与基体之间元素扩散增强

冶金结合强度提高。

Abstract

In order to understand influence of preheating temperature on TiC/Ni functionally gradient coating

the TiC/Ni functionally gradient coating on H13 steel surface was prepared by self-propagating high temperature synthesis and pseudo hot isostatic pressing（SHS/PHIP）.The phase and microstructure of the coating were analyzed by XRD and SEM-EDS.Microhardness and bonding strength of the coating were tested by microhardness tester.The results reveal that the coating mainly consists of TiC particles generated in situ and Ni-based solid solution which closely wraps around the TiC particles.The coatings present porous skeleton structures.With the increase of preheating temperature

the coating surface porosities are decreased

while density

TiC grain size and surface hardness are increased.Meanwhile

element diffusion between coating and matrix is enhanced

and metallurgical bonding strength is increased.