低Ag无铅钎料SnAgCuBiNi的界面生长与可靠性分析

成军; 屈敏; 崔岩; 刘峰斌

doi:10.15980/j.tzzz.2017.10.031

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低Ag无铅钎料SnAgCuBiNi的界面生长与可靠性分析
InterfaceGrowth and Reliability Analysis of the Low Ag Lead-free Solder SnAgCuBiNi
- 角色： First author 第一作者
- 机构：
  北方工业大学机械与材料工程学院
成军
1 ，
- 机构：
  北方工业大学机械与材料工程学院
屈敏
1 ，
- 机构：
  北方工业大学机械与材料工程学院
崔岩
1 ，
- 机构：
  北方工业大学机械与材料工程学院
刘峰斌
1
2017年37卷第10期页码：1157-1160
纸质出版日期： 2017 ，
DOI： 10.15980/j.tzzz.2017.10.031

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引用
[1]成军,屈敏,崔岩,刘峰斌.低Ag无铅钎料SnAgCuBiNi的界面生长与可靠性分析[J].特种铸造及有色合金,2017,37(10):1157-1160.

Cheng Jun, Qu Min, Cui Yan, et al. InterfaceGrowth and Reliability Analysis of the Low Ag Lead-free Solder SnAgCuBiNi[J]. Special Casting & Nonferrous Alloys, 2017,37(10):1157-1160.
[1]成军,屈敏,崔岩,刘峰斌.低Ag无铅钎料SnAgCuBiNi的界面生长与可靠性分析[J].特种铸造及有色合金,2017,37(10):1157-1160. DOI： 10.15980/j.tzzz.2017.10.031.

Cheng Jun, Qu Min, Cui Yan, et al. InterfaceGrowth and Reliability Analysis of the Low Ag Lead-free Solder SnAgCuBiNi[J]. Special Casting & Nonferrous Alloys, 2017,37(10):1157-1160. DOI： 10.15980/j.tzzz.2017.10.031.

摘要

选取低Ag钎料Sn-0.3Ag-0.7Cu-0.5Bi-Ni（SACBN）与Sn-3.0Ag-0.5Cu（SAC305）做对比,采用回流炉制备SACBN与SAC305焊点,测量了SACBN和SAC305钎料的扩展率和润湿角,对SACBN进行260℃回流焊,SAC305进行250℃回流焊。对各焊点试样进行150℃下不同时间的时效处理。结果表明,SAC305焊料的扩展率为76.75%,润湿角为22.11°。SACBN焊料的扩展率为74.15%,润湿角为25.87°,两者润湿性能接近。不同时效时间下SACBN的金属间化合物（IMC）的厚度均小于SAC305,且SACBN的生长系数小于SAC305。

译

Abstract

Low Ag solder Sn-0.3 Ag-0.7 Cu-0.5 Bi-Ni（SACBN）and Sn-3.0 Ag-0.5 Cu（SAC305）were selected to be analyzed comparatively.The solder reflow oven was applied to prepare the SACBN and SAC305 solder joints.The wetting angle and expansion rate of the SACBN and SAC305 solder joints were measured.The temperature of reflow soldering of SACBN is 260 ℃ and SAC305 is 250 ℃.The solder joints were treated by aging treatment at 150 ℃ for 48,72,144,192,and 240 h,respectively.The results show that the expansion rate of SACBN is 74.15% with the wetting angle of 25.87°.The expansion rate of SAC305 is 76.75% with the wetting angle of 22.11°.The wetting properties of SACBN are closed to those of SAC305.The IMC thickness of SACBN is less than that of SAC305,and the growth coefficient of SACBN is less than that of SAC305.

译

关键词

SnAgCuBiNi钎料; 时效; 扩展率与润湿角; 生长系数

译

Keywords

SnAgCuBiNi Solder Alloys; Aging; Expansion Rate and Wetting Angle; Growth Coefficient

译

摘要

选取低Ag钎料Sn-0.3Ag-0.7Cu-0.5Bi-Ni（SACBN）与Sn-3.0Ag-0.5Cu（SAC305）做对比

采用回流炉制备SACBN与SAC305焊点

测量了SACBN和SAC305钎料的扩展率和润湿角

对SACBN进行260℃回流焊

SAC305进行250℃回流焊。对各焊点试样进行150℃下不同时间的时效处理。结果表明

SAC305焊料的扩展率为76.75%

润湿角为22.11°。SACBN焊料的扩展率为74.15%

润湿角为25.87°

两者润湿性能接近。不同时效时间下SACBN的金属间化合物（IMC）的厚度均小于SAC305

且SACBN的生长系数小于SAC305。

Abstract

144

192

and 240 h

respectively.The results show that the expansion rate of SACBN is 74.15% with the wetting angle of 25.87°.The expansion rate of SAC305 is 76.75% with the wetting angle of 22.11°.The wetting properties of SACBN are closed to those of SAC305.The IMC thickness of SACBN is less than that of SAC305

and the growth coefficient of SACBN is less than that of SAC305.