Effects of homogenization treatment on microstructure and properties of Cu-Fe-Ag in-situ copper based composites were investigated.The results show that the homogenization treatment can refine the primary Fe dendrites and deformed microstructure

resulting in promoting the precipitation of Fe from Cu matrix to form secondary Fe particles and nano-α-Fe particle.Furthermore

the homogenization treatment can enhance the strength and electrical conductivity of Cu-Fe-Ag in-situ copper based composites.Dislocation multiplication and interface obstacle are responsible for the strengthening mechanism.The decrease of Fe in Cu matrix is responsible for the increase of electrical conductivity due to the prior homogenization treatment before cold deformation.