SiC

p

/Al matrix composites for electronic packaging were prepared by thixoforming technique at different remelting temperatures.The results reveal that alloy matrix is connected each other to form net-like structure in the thixoformed Al matrix composites

and SiC particulates are well distributed in the aluminum matrix.With the increase of remelting temperature

the relative density

thermal conductivity（TC）

bending strength and hardness can be improved obviously while the coefficient of thermal expansion（CTE）is decreased

and the main fracture mode is characterized by the brittle fracture.The ultimate thermal conductivity（TC）

hardness and bending strength of the composites prepared reach117.54

1

35.51 W·m

-1

·K

-1

99.47

1

13.52 HV

325.90

3

46.91 MPa

respectively.Meanwhile

the mean linear coefficient of thermal expansion（CTE）of composites from room temperature to 300℃is less than 7×10

-6

℃

-1

.