SiCp/Cu composites were prepared by the vacuum hot-pressed sintered technology and powder metallurgy method.The thermal conductivity of the composites at room temperature was measured by laser pulse method.The results reveal that that thermal conductivity of the alloy is decreased gradually with the increase of SiCpvolume fraction

especially the volume fraction more than 30% SiCp.The thermal conductivity of the composites is related with internal defects

the mismatch between copper and SiCpparticle as well as interface reaction.In order to prepare composites with good thermal conductivity properties

volume fraction of SiCpparticles should be controlled strictly at 15%to 30%to improve density and reducing the dislocations

voids and other defects.