电解铜箔翘曲原因分析

易光斌; 杨湘杰; 彭文屹; 黄永发; 王平; 黎志勇

doi:10.15980/j.tzzz.2015.03.006

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电解铜箔翘曲原因分析
Analysis of Bending of Electrolytic Copper Foils
2015年35卷第3期页码：244-247
纸质出版日期： 2015 ，
DOI： 10.15980/j.tzzz.2015.03.006

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[1]易光斌,杨湘杰,彭文屹,黄永发,王平,黎志勇.电解铜箔翘曲原因分析[J].特种铸造及有色合金,2015,35(03):244-247.

Yi Guangbin, Yang Xiangjie, Peng Wenyi, et al. Analysis of Bending of Electrolytic Copper Foils[J]. Special Casting & Nonferrous Alloys, 2015,35(3):244-247.
[1]易光斌,杨湘杰,彭文屹,黄永发,王平,黎志勇.电解铜箔翘曲原因分析[J].特种铸造及有色合金,2015,35(03):244-247. DOI： 10.15980/j.tzzz.2015.03.006.

Yi Guangbin, Yang Xiangjie, Peng Wenyi, et al. Analysis of Bending of Electrolytic Copper Foils[J]. Special Casting & Nonferrous Alloys, 2015,35(3):244-247. DOI： 10.15980/j.tzzz.2015.03.006.

摘要

超薄电解铜箔生产工艺不稳定易导致铜箔翘曲缺陷

严重影响铜箔后续加工及产品品质。针对铜箔翘曲问题

选取5家铜箔生产厂家生产的18μm厚的不同程度翘曲电解铜箔样品

做内应力、织构、晶粒等测试

分析翘曲原因。通过试验验证了添加剂SP（聚二硫二丙烷磺酸钠）、HEC（羟乙基纤维素）、PEG（聚乙二醇）会引起铜箔翘曲。铜箔翘曲是残余应力作用的结果

而残余应力与铜箔织构、孪晶界、晶粒尺寸及内部孔洞有一定关系。添加剂通过改变铜箔织构、晶粒大小等来影响翘曲。（220）织构的增多或晶粒细化会增大铜箔翘曲。

Abstract

The bending of ultra-thin electrolytic copper foil may be observed due to the instability of production process

which seriously affects the subsequent processing and product quality.Copper samples with 18 mm in thickness and different warping degree from the five companies were analyzed for internal stress

texture

grain size.to explore the mechanism of bending.Experimental results show that the additives SP

HEC and PEG can cause copper foil bending

which is attributed to the residual stress related with texture

twin boundaries

grain size and internal pores.The additives can result in bending by changing the textures and grain sizes of copper.The degree of bending can be enhanced with the increase of（220）texture and the decrease of grain size.