重熔保温时间对ZCuSn10铜合金半固态组织的影响

崔体静; 白丹; 肖寒

doi:10.15980/j.tzzz.2015.02.014

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重熔保温时间对ZCuSn10铜合金半固态组织的影响
Effect of Holding Time on Microstructure of Semi-Solid ZCuSn10Copper Alloy during Remelting Process
2015年35卷第2期页码：159-161
纸质出版日期： 2015 ，
DOI： 10.15980/j.tzzz.2015.02.014

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[1]崔体静,白丹,肖寒.重熔保温时间对ZCuSn10铜合金半固态组织的影响[J].特种铸造及有色合金,2015,35(02):159-161.

Cui Tijing, Bai Dan, Xiao Han. Effect of Holding Time on Microstructure of Semi-Solid ZCuSn10Copper Alloy during Remelting Process[J]. Special Casting & Nonferrous Alloys, 2015,35(2):159-161.
[1]崔体静,白丹,肖寒.重熔保温时间对ZCuSn10铜合金半固态组织的影响[J].特种铸造及有色合金,2015,35(02):159-161. DOI： 10.15980/j.tzzz.2015.02.014.

Cui Tijing, Bai Dan, Xiao Han. Effect of Holding Time on Microstructure of Semi-Solid ZCuSn10Copper Alloy during Remelting Process[J]. Special Casting & Nonferrous Alloys, 2015,35(2):159-161. DOI： 10.15980/j.tzzz.2015.02.014.

摘要

采用冷轧与重熔的应变诱导熔化激活法制备了ZCuSn10铜合金半固态坯料

分析了重熔过程中保温时间对ZCuSn10铜合金半固态坯料微观组织的影响。结果表明

通过二道次轧制得到变形量为17%的试样

截取试样进行910℃保温重熔处理。随着保温时间延长

合金的平均晶粒直径增大

保温时间从10min延长至25min时

平均晶粒直径由70.6μm增大至88.0μm

晶粒形状因子则随保温时间的延长先增加再减小

保温25 min时达到最低值为2.18

液相率为27.80%

此时获得的半固态组织球化效果好

晶粒圆整度较好

晶粒尺寸和液相比较均匀。

Abstract

Semi-solid ZCuSn10 copper alloy billets were fabricated by strain induced melt activation based on cold rolling and remelting method

and effects of holding time on microstructure of semi-solid ZCuSn10 copper alloy were investigated during remelting process.The results indicate that the sample with the two passes rolling deformation to 17%is cut and remelted at 910 ℃.With the increase of the holding time from 10 min to 25 min

the average grain diameter is increases from 70.6μm to 88.0μm

and the shape factor is increased firstly and then decreased.The smallest factor can be obtained with holding for 25 min

where the semi-solid ZCuSn10 copper alloy slurry with spherical grains and uniform can be observed with the more uniform grain size and the liquid phase.The average grain diameter and the shape factor

the liquid fraction of the alloy reach 88.0μm

2.18

27.80%

respectively.