85℃时效Sn-8Zn-3Bi/Cu焊点界面化合物生长行为

赵柏森; 赵国际

doi:10.15980/j.tzzz.2015.01.027

重有色合金 | 浏览量 : 0 下载量: 96 CSCD: 2

导出
分享
收藏
专辑

85℃时效Sn-8Zn-3Bi/Cu焊点界面化合物生长行为
Growth Behavior of Interfacial Compounds in Sn-8Zn-3Bi/Cu Joints with Aging at 85 ℃
2015年35卷第1期页码：91-93
纸质出版日期： 2015 ，
DOI： 10.15980/j.tzzz.2015.01.027

扫描看全文

[1]赵柏森,赵国际.85℃时效Sn-8Zn-3Bi/Cu焊点界面化合物生长行为[J].特种铸造及有色合金,2015,35(01):91-93.

Zhao Baisen, Zhao Guoji. Growth Behavior of Interfacial Compounds in Sn-8Zn-3Bi/Cu Joints with Aging at 85 ℃[J]. Special Casting & Nonferrous Alloys, 2015,35(1):91-93.
[1]赵柏森,赵国际.85℃时效Sn-8Zn-3Bi/Cu焊点界面化合物生长行为[J].特种铸造及有色合金,2015,35(01):91-93. DOI： 10.15980/j.tzzz.2015.01.027.

Zhao Baisen, Zhao Guoji. Growth Behavior of Interfacial Compounds in Sn-8Zn-3Bi/Cu Joints with Aging at 85 ℃[J]. Special Casting & Nonferrous Alloys, 2015,35(1):91-93. DOI： 10.15980/j.tzzz.2015.01.027.

摘要

以Sn-9Zn/Cu焊点为参比物

研究了Sn-8Zn-3Bi/Cu焊点在85℃时效条件下界面金属间化合物（IMC）的生长行为。结果表明

相同钎焊工艺条件下

与Sn-9Zn/Cu相比

Sn-8Zn-3Bi/Cu界面反应更为充分。在85℃时效过程中

Sn-9Zn/Cu界面IMC结构稳定

Sn-8Zn-3Bi/Cu焊点界面IMC生长速率变化不大

界面IMC层增厚速率在界面反应初期较快而在后期则显著下降。Bi的添加对合金熔点的降低促进了界面初期反应过程的充分进行。随着界面反应时间的延长

Bi对Cu-Zn（IMC）层的生长表现出明显的抑制作用

界面IMC生长动力学时间指数显著减小。

Abstract

By comparing with Sn-9Zn/Cu joints

the growth behavior of interfacial intermetallic compound（IMC）in Sn-8Zn-3Bi/Cu joints with isothermal aging at 85℃ was investigated.The results show that the interfacial reaction of Sn-8Zn-3Bi/Cu exhibits more sufficient compared with Sn-9Zn/Cu at the same soldering process.During isothermal aging at 85 ℃

the interfacial IMC layer exhibits stable and the change of growth rate of IMC at the interface of Sn-8Zn-3Bi/Cu joints becomes slight.The growth rate of the interfacial IMC layer of Sn-8Zn-3Bi/Cu joints exhibits fast at initial stage

and then slow down obviously.The melting point of solder is decreased due to the addition of Bi

resulting in a sufficient reaction of interface at the initial stage.With increasing in interfacial reaction time

the suppression effect of Bi on Cu-Zn IMC appears significantly

and the time index of growth kinetics is decreased markedly.