Yan Jun, Cui Haiping, Du Shiguo, et al. Sol-Gel Process for Improving the Oxidation-resistance of Copper Powder[J]. Special Casting & Nonferrous Alloys, 2006,(7):459-461.
Yan Jun, Cui Haiping, Du Shiguo, et al. Sol-Gel Process for Improving the Oxidation-resistance of Copper Powder[J]. Special Casting & Nonferrous Alloys, 2006,(7):459-461.DOI:
film is formed to clad the surface of the Cu powder by hydrolyzing sol-gel process for improving the oxidation resistance of copper powders. Effects of various water
acid and sol-gel quantity on cladding effects are investigated by measuring transmissivity rate away from 760 nm of the solution under the condition of eroding the samples in 5% H
2
SO
4
solution for four hours. The results show that the transimissivity rate of the coat samples at 760 nm is more than 80% with 1 to 2 of Ti(OBu)
4
and H
2
O
0.32 mol/L of H
+
content and 4%
6
% TiO
2
sol
while that of initial samples is 15%.SEM
EDS
XPS and XRD are employed to characterize the coated samples. XPS analysis shows that the main elements in the surface of the coated copper podwders are Ti
Sn
C
O and Cu
in which Ti and Sn are in the state of Ti
+4 and Sn
+2
respectively. The XRD analysis for coated copper powder and initial samples after 60 day in air indicates that the advents of Cu
2
O in surface of the initial samples are observed
while only Cu can be observed in the coated samples.