SiC<sub>p</sub>/Cu包覆粉体及其热沉材料的制备

王常春; Suk-Bong Kang; 闵光辉

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SiC_p/Cu包覆粉体及其热沉材料的制备
Fabrication of Cu-coated SiC_p Powder and Its Heat Sink Materials
2006年第10期页码：620-622
纸质出版日期： 2006 ，
DOI：

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[1]王常春,Suk-Bong Kang,闵光辉.SiC_p/Cu包覆粉体及其热沉材料的制备[J].特种铸造及有色合金,2006(10):620-622+604.

Wang Changchun 1, Suk-bong Kang2, Min Guanghui1. Fabrication of Cu-coated SiC_p Powder and Its Heat Sink Materials[J]. Special Casting & Nonferrous Alloys, 2006,(10):620-622.
[1]王常春,Suk-Bong Kang,闵光辉.SiC_p/Cu包覆粉体及其热沉材料的制备[J].特种铸造及有色合金,2006(10):620-622+604. DOI：

Wang Changchun 1, Suk-bong Kang2, Min Guanghui1. Fabrication of Cu-coated SiC_p Powder and Its Heat Sink Materials[J]. Special Casting & Nonferrous Alloys, 2006,(10):620-622. DOI：

摘要

采用化学镀铜工艺制备了Cu包覆SiCp复合粉体

并对复合粉体的组成和形貌进行了分析。同时

利用制得的复合粉体

结合适当的热压烧结工艺制备了Cu-35SiCp热沉材料

并对热沉材料的微观组织和热物理性能进行了研究。结果表明

SiCp颗粒在热沉材料的基体中均匀分布

界面结合良好。在试验条件下

Cu-35SiCp热沉材料的导热系数为165.7W/（m.K）

30～200℃温度区间内的热膨胀系数为15.1×10-6/K。

Abstract

The composition and morphology of Cu-coated SiC

powder prepared by electro-plating have been investigated.Moreover

Cu-35%SiC

heat sink materials were fabricated by hot pressing based on the coated powder

and its microstructure and thermo-physical properties have been observed.The results show that SiC

particle is uniformly distributed in the matrix with ideal interfacial bonding.With a given condition

the thermal conductivity of the Cu-35%SiCp heat sink materials is 165.7 W/（m·K）and the thermal expansion coefficient is 15.1×10-6/K in the range of 30～200 ℃

which provides a reference for further research.