Wang Hanlin1, Liu Guoxiang1, Wu Shengchuan2, et al. Finite Element Analysis of Stress Field in Plasma Powder Deposition Manufacturing[J]. Special Casting & Nonferrous Alloys, 2007,(11):838-840.
Wang Hanlin1, Liu Guoxiang1, Wu Shengchuan2, et al. Finite Element Analysis of Stress Field in Plasma Powder Deposition Manufacturing[J]. Special Casting & Nonferrous Alloys, 2007,(11):838-840.DOI:
the thermal stress can be formed in the deposition layers due to the alternate heating-cooling during moving deposition
which can result in the creation of hot crack as a result of high residual stress after cooling.It is important to investigate the effects of scanning rate of stress field during plasma powder deposition and cooling conditions on hot crack.The heat transferring in plasma powder deposition is simulated by the finite element method.The thermal stress field in plasma powder deposition has been calculated through varying scanning rate according to the features of superalloy.The results reveal that with increasing scanning rate
the peak value of thermal stress can be decreased and the stress field can be more uniformly distributed
leading to the lower residual stress after cooling.
关键词
等离子熔积制造熔积速率有限元模拟热应力场
Keywords
Plasma Powder Deposition ManufacturingScanning RateFinite Element MethodThermal Stress Field