The bonding strength and interface morphology of pure Ti that is plated TiSiN film with different Si content by the magnetron sputtering method and Solidex were investigated by AGS materials testing machine and EMPA（electron microscope probe analysis）.Variance analysis reveals that the bonding strength of TiSiN plated pure Ti and Solidex is superior to that of the pure Ti and the Solidex

furthermore

the bonding strength can be increased with increasing in Si content in TiSiN film.The compact amorphous TiN and SiNx phase can be generated in the film and be filled into the porosity between the metal matrix and Solidex light-cured hard crown and bridge composites

which is helpful for preventing the leakage of metal ion from the film

so the bonding strength is improved.