易切削Cu-Se-Bi合金的高温塑性变形行为

杨斌; 张丽娜; 谢建新

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易切削Cu-Se-Bi合金的高温塑性变形行为
Hot Deformation Behavior of Free-cutting Cu-Se-Bi Alloy
- 角色： First author 第一作者
- 机构：
    江西理工大学材料与化学工程学院
    江西理工大学应用科学学院
    北京科技大学材料科学与工程学院北京科技大学材料科学与工程学院
杨斌
1 2 3 ，
- 机构：
    江西理工大学材料与化学工程学院
    江西理工大学应用科学学院
    北京科技大学材料科学与工程学院北京科技大学材料科学与工程学院
张丽娜
1 2 3 ，
- 机构：
    江西理工大学材料与化学工程学院
    江西理工大学应用科学学院
    北京科技大学材料科学与工程学院北京科技大学材料科学与工程学院
谢建新
1 2 3
2008年第3期页码：235-238
纸质出版日期： 2008 ，
DOI：

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引用
[1]杨斌,张丽娜,谢建新.易切削Cu-Se-Bi合金的高温塑性变形行为[J].特种铸造及有色合金,2008(03):235-238+164.

Yang Bin1, Zhang Lina3, Xie Jianxin1. Hot Deformation Behavior of Free-cutting Cu-Se-Bi Alloy[J]. Special Casting & Nonferrous Alloys, 2008,(3):235-238.
[1]杨斌,张丽娜,谢建新.易切削Cu-Se-Bi合金的高温塑性变形行为[J].特种铸造及有色合金,2008(03):235-238+164. DOI：

Yang Bin1, Zhang Lina3, Xie Jianxin1. Hot Deformation Behavior of Free-cutting Cu-Se-Bi Alloy[J]. Special Casting & Nonferrous Alloys, 2008,(3):235-238. DOI：

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摘要

采用Gleeble-1500热模拟机研究了Cu-Se-Bi合金在变形温度为550～700℃,应变速率为0.01～10.00s-1条件下的流变应力变化规律和微观组织,并根据试验数据确定了本构方程。结果表明,Cu-Se-Bi合金高温动态再结晶明显降低合金的流变应力,变形量在15%～80%时,流变应力趋于稳定;当应变速率为2.50、10.00s-1时,流变应力出现波动,温度为700℃、应变速率为10.00s-1、应变在0.09～0.15时应力波动值可达12MPa;变形量越大,动态再结晶越明显;应变速率越小,晶粒越细小;当温度为600℃、变形量为60%、应变速率为0.01s-1时,平均晶粒尺寸为8.5μm。

译

Abstract

The hot deformation behavior and microstructure of the Cu-Se-Bi alloy were investigated by thermal compression with Gleeble-1500 machine with the deformed temperature in range of 550 ℃ to 700 ℃ and strain rate at 0.01¹0 s-1,and the constitutive equation for the hot deformation behavior has been established based on the experimental data.The results reveal that the dynamic recrystallization at high temperature in Cu-Se-Bi alloy can remarkably decrease the flow stress which tends to a constant value with 15%⁸0% deformation rate.The fluctuant of the flow stress can be observed with the strain rate in range of 2.5 s-1 to 10 s-1,in which the maximum fluctuant value of 12 MPa can be observed with strain rate of 10 s-1 and true strain of 0.01⁰.15 at 700 ℃.The recrystallization is increased with the increase of the strain,and the grain size is decreased with the decrease of strain rate.The average grain size of 8.5 μm can be obtained with the strain of 60% and strain rate of 0.01 s-1 at 600 ℃.

译

关键词

Cu-Se-Bi合金; 热模拟; 本构方程; 动态再结晶

译

Keywords

Cu-Se-Bi Alloy; Thermal Analogue; Constitutive Equation; Dynamic Recrystallization

译

摘要

采用Gleeble-1500热模拟机研究了Cu-Se-Bi合金在变形温度为550～700℃

应变速率为0.01～10.00s-1条件下的流变应力变化规律和微观组织

并根据试验数据确定了本构方程。结果表明

Cu-Se-Bi合金高温动态再结晶明显降低合金的流变应力

变形量在15%～80%时

流变应力趋于稳定;当应变速率为2.50、10.00s-1时

流变应力出现波动

温度为700℃、应变速率为10.00s-1、应变在0.09～0.15时应力波动值可达12MPa;变形量越大

动态再结晶越明显;应变速率越小

晶粒越细小;当温度为600℃、变形量为60%、应变速率为0.01s-1时

平均晶粒尺寸为8.5μm。

Abstract

0 s-1

and the constitutive equation for the hot deformation behavior has been established based on the experimental data.The results reveal that the dynamic recrystallization at high temperature in Cu-Se-Bi alloy can remarkably decrease the flow stress which tends to a constant value with 15%

0% deformation rate.The fluctuant of the flow stress can be observed with the strain rate in range of 2.5 s-1 to 10 s-1

in which the maximum fluctuant value of 12 MPa can be observed with strain rate of 10 s-1 and true strain of 0.01

.15 at 700 ℃.The recrystallization is increased with the increase of the strain

and the grain size is decreased with the decrease of strain rate.The average grain size of 8.5 μm can be obtained with the strain of 60% and strain rate of 0.01 s-1 at 600 ℃.