微量RE对Sn-2.5Ag-0.7Cu钎料合金润湿性的影响

王要利; 张柯柯; 程光辉; 韩丽娟; 赵国际; 刘帅

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微量RE对Sn-2.5Ag-0.7Cu钎料合金润湿性的影响
Effects of RE on the Wettability of Low Ag Sn-2.5Ag-0.7Cu Solder Alloy
2008年第8期页码：651-653
纸质出版日期： 2008 ，
DOI：

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[1]王要利,张柯柯,程光辉,韩丽娟,赵国际,刘帅.微量RE对Sn-2.5Ag-0.7Cu钎料合金润湿性的影响[J].特种铸造及有色合金,2008(08):651-653+574.

Wang Yaoli1, Zhang Keke1, Cheng Guanghui3, et al. Effects of RE on the Wettability of Low Ag Sn-2.5Ag-0.7Cu Solder Alloy[J]. Special Casting & Nonferrous Alloys, 2008,(8):651-653.
[1]王要利,张柯柯,程光辉,韩丽娟,赵国际,刘帅.微量RE对Sn-2.5Ag-0.7Cu钎料合金润湿性的影响[J].特种铸造及有色合金,2008(08):651-653+574. DOI：

Wang Yaoli1, Zhang Keke1, Cheng Guanghui3, et al. Effects of RE on the Wettability of Low Ag Sn-2.5Ag-0.7Cu Solder Alloy[J]. Special Casting & Nonferrous Alloys, 2008,(8):651-653. DOI：

摘要

采用润湿平衡法

研究了水洗钎剂条件下Sn-2.5Ag-0.7Cu-xRE无铅钎料合金在1206片式元器件和Cu焊盘上的润湿性。结果表明

添加质量分数为0.1%的RE的Sn-2.5Ag-0.7Cu钎料合金在1206表面贴装元器件和Cu焊盘上有最大的润湿力和铺展面积及最小的润湿角

其润湿性最好

润湿力优于Sn-3.8Ag-0.7Cu钎料合金

满足微电子行业对润湿性能的要求。

Abstract

The wettability of Sn-2.5Ag-0.7Cu-xRE lead-free solder alloy on the 1206 component and Cu substrate was examined with the water-soluble flux by means of the wetting balance method. The results indicate that the highest wetting force and the biggest spreading area as well as the smallest wetting angle can be obtained with adding 0.1%RE in the Sn-2.5Ag-0.7Cu solder alloy

exhibiting desirable wetting properties

which can fully meet the wettability requirement of surface mount component due to its wetting force superior to that of commercial Sn3.8Ag0.7Cu solder alloy.