Effects of aging temperature and aging time on microstructure and properties of Cu-2Ni-0.5Si alloy were investigated after varying cold deformation. The results indicate that the secondary phase is dispersively distributed in the alloy with solid solution at 900 ℃ and then aging treatment after varying cold deformation. The micro-hardness and electronic conductivity of the 80% deformed alloy with aging at 500 ℃ for 1h are 250 and 22.625 MS/m

respectively

exhibiting higher comprehensive properties compared with those without cold deformation. Pre-cold deformation before aging can strongly accelerate the precipitation of secondary phase in the alloy during aging

which is responsible for the improvement of micro-hardness and electronic conductivity. The tensile strength of the 40% pre-cold deformed alloy with aging at 450 ℃ for 4 h can reach up to 620 MPa

and the fracture morphology is characterized by typical ductile fracture mode.