Xu Tianhan1, Wang Danghui1. Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy[J]. Special Casting & Nonferrous Alloys, 2009,29(10):969-972.
Xu Tianhan1, Wang Danghui1. Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy[J]. Special Casting & Nonferrous Alloys, 2009,29(10):969-972.DOI:
We have developed an ultrasonic atomizing equipment to have successfully prepared Sn3Ag2.8Cu lead free solder powder. The microstructure of the powders at different atomizing medium is compared with that of the conventional alloy
and a type of optimized powder is selected to compare its solderability with that of the conventional alloy. The results reveal that the solidification rate of nitrogen atomized powder is faster than that of air atomized one. The microstructure of atomized powder with finer grain size is composed of polygonal Cu6Sn5 and granular Ag3Sn IMC (intermetallic compound) which are distributed dispersively in the matrix. The IMC of the powder with Cu substrate is more irregular
and the interface between diffusion layer and Cu substrate is more blurry than that of conventional alloy with Cu substrate. In addition
the creep rupture life of the atomized powder is greatly improved compared with the conventional alloy. So the comprehensive properties of the Sn3Ag2.8Cu lead free solder powder is distinctly superior to that of the conventional alloy.