Thixo-compression behavior and microstructure of SiCp/Al alloy matrix composites were investigated with the help of Gleeble-1500 thermal-mechanical simulator under different deformation temperatures and different deformation rates.It is found that

with increasing in strain

compressive stress of the composites is firstly increased rapidly

then decreased rapidly

and at last increased slowly.In addition

with decreasing in deformation temperature or increasing in deformation rates

compressive stress is increased in semi-solid composites.After compressive deformation

more small SiC particles with average size less than 20μm and approximately 55% in volumetric fraction are mainly not distributed in severe deformation zone but in free deformation zone

which shows that high SiC zone can be created from separation of liquid-solid phase by semi-solid thixo-compression

meeting the requirements of electronic package materials.