Sn-Bi and Sn-Bi-Cu alloys were prepared by using pure Sn

Bi and Cu.Creep curves were mapped by indentation creep testing

and change of indentation creep with loading and temperature was described.Chemical composition of precipitated phase and microstructure before and after creep were analyzed by X-ray diffraction （XRD） and scanning electron microscope（SEM ） to understand effects of Cu on indentation creep behavior and microstructure of Sn-Bi alloy.The results reveal that creep resistance of Sn-Bi solder is improved with adding Cu.The precipitate in the Sn-Bi alloy is Bi while it is Cu6Sn5 and trace granular phase Bi in Sn-Bi-Cu alloy before creep.After creep

granular phase Bi is refined and dispersedly distributed in the matrix alloy

while block precipitates are converted into Cu6Sn5 particle with smooth edge and with the disappearance of Bi phase in Sn-Bi-Cu alloy as a result of occurrence of recrystallization

responsible for the improvement of creep resistance of the alloy.