利用有限元分析软件模拟计算了Cu-Al-Cu复合板参数对导电性能的影响。模拟结果表明,在加载一定的情况下,Cu-Al复合板的导电性随着铜层厚度的增加而提高,Cu层厚度超过0.5mm,Cu层厚度变化对复合板阻抗影响很小;当Cu-Al复合板宽度保持一定时,随着复合板厚度的增加,复合板的阻抗呈明显的下降趋势,但复合板厚度的增加对复合板导电性能的影响越来越小;当Cu层厚度保持一定时,随着复合板厚度的增加,复合板的阻抗逐渐减小,随着复合板宽度的增加,厚度对其复合板阻抗的影响也越来越小。
Effects of cladding size changes on electric conductivity of copper-aluminum-copper cladding plate were examined by the FEM (finite element method) software.It is found that with a fixed loading,electric conductivity of copper-aluminum-copper cladding plate is increased with increasing in copper thickness.However,with copper thickness more than 0.5 mm,effects of copper thickness on impedance of cladding plate can be neglected.At a fixed cladding width,with increasing in cladding thickness,impedance of the cladding plate is greatly decreased,while effects on electric conductivity are slowly weakened.At a given copper thickness,with increasing in cladding thickness,impedance of the cladding plate is decreased,and with increasing in width of cladding plate,effects of thickness on impedance of the plate are greatly weakened.
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