The roles of plating assistant agent KF in Cu/Al liquid-solid compound during hot-dipping process were analyzed

and effects of liquid aluminum temperature

dipping time on thickness of metallurgical bonding layer and its constituent were described. An acceptable hot-dipping parameters were determined. Desirable compound effects can be obtained in the Cu/Al bimetallic composites with dipping surface treated samples in the KF solution for 4 min and then hot-dipping at 720℃ for 25 s

which provides a theoretical basis for further investigating Cu/Al liquid-solid compound technology.