Dynamic recrystallization behavior and microstructural evolution of Cu-2.0Ni-0.5Si-0.15Ag alloy during hot compressive deformation were investigated by isothermal compression testing at the Gleeble-1500D thermal-mechanical simulator at the temperature from 600℃ to 800℃ with strain rate from 0.01s-1 to 5s-1 under the condition of 60% strain. Recrystallized fraction at varied deformation conditions was determined based on σ-ε curves

which was employed to establish kinetic equation for dynamic recrystallization in the alloy. The dynamic recrystallized microstructure depend on the deformation strain rates. Relationship between the dynamic recrystallization grain and parameter Z is as follows: Ddyn=0.59×103Z-0.08.