SiC<sub>p</sub>/Cu合金电子封装壳体半固态成形模拟

宋普光; 王开坤; 王元宁

半固态加工 | 浏览量 : 0 下载量: 133 CSCD: 1

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SiC_p/Cu合金电子封装壳体半固态成形模拟
Simulation of Semi-solid Forming Electronic Packaging Shell with SiC_p/Cu Alloy
2011年31卷第7期页码：626-629
纸质出版日期： 2011 ，
DOI：

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[1]宋普光,王开坤,王元宁.SiC_p/Cu合金电子封装壳体半固态成形模拟[J].特种铸造及有色合金,2011,31(07):626-629.

Song Puguang, Wang Kaikun, Wang Yuanning. Simulation of Semi-solid Forming Electronic Packaging Shell with SiC_p/Cu Alloy[J]. Special Casting & Nonferrous Alloys, 2011,31(7):626-629.
[1]宋普光,王开坤,王元宁.SiC_p/Cu合金电子封装壳体半固态成形模拟[J].特种铸造及有色合金,2011,31(07):626-629. DOI：

Song Puguang, Wang Kaikun, Wang Yuanning. Simulation of Semi-solid Forming Electronic Packaging Shell with SiC_p/Cu Alloy[J]. Special Casting & Nonferrous Alloys, 2011,31(7):626-629. DOI：

摘要

采用有限元软件Deform-3DTM对SiCp/Cu合金电子封装壳体的触变成形过程进行了数值模拟。对触变成形过程中坯料的单元体网格变化、金属流动速度场、等效应力场及挤压杆速度对等效应力的影响等进行了分析。模拟结果表明

在半固态温度为910℃、挤压杆速度为100mm/s时

可以得到SiCp含量较高且分布较均匀的SiCp/Cu合金电子封装壳体

且能满足电子封装壳体的要求。

Abstract

Thixoforming process of electronic packaging shell with SiCp/Cu alloy was simulated by the finite element software Deform-3D. Effects of some parameters

such as grid change of unit

flow velocity of liquid metal and equivalent stress field as well as punching velocity

on equivalent stress were simulated in the semi-solid billets during thioxforming process. The results show that SiCp/Cu alloy electronic packaging shell with high content and uniformly distributed SiC particle can be produced at 910℃ and punching velocity of 100 mm/s

meeting the requirements of electronic packaging shell.