SnAgCu无铅焊点界面组织及抗拉强度在时效过程中的演变

姚健; 卫国强; 石永华

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SnAgCu无铅焊点界面组织及抗拉强度在时效过程中的演变
Evolution of Interfacial Intermetallic Compound and Tensile Strength of SnAgCu Lead-free Solder Joints during Aging Treatment Process
2011年31卷第3期页码：281-284
纸质出版日期： 2011 ，
DOI：

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[1]姚健,卫国强,石永华.SnAgCu无铅焊点界面组织及抗拉强度在时效过程中的演变[J].特种铸造及有色合金,2011,31(03):281-284+195.

Yao Jian, Wei Guoqiang, Shi Yonghua. Evolution of Interfacial Intermetallic Compound and Tensile Strength of SnAgCu Lead-free Solder Joints during Aging Treatment Process[J]. Special Casting & Nonferrous Alloys, 2011,31(3):281-284.
[1]姚健,卫国强,石永华.SnAgCu无铅焊点界面组织及抗拉强度在时效过程中的演变[J].特种铸造及有色合金,2011,31(03):281-284+195. DOI：

Yao Jian, Wei Guoqiang, Shi Yonghua. Evolution of Interfacial Intermetallic Compound and Tensile Strength of SnAgCu Lead-free Solder Joints during Aging Treatment Process[J]. Special Casting & Nonferrous Alloys, 2011,31(3):281-284. DOI：

摘要

采用扫描电镜（SEM）、能谱仪（EDS）和微拉伸试验

研究Cu/Sn-3Ag-0.5Cu/Cu引线对接焊点分别在100、125、150℃时效时焊点界面IMC的生长和抗拉强度的变化

同时对互连焊点的断口形貌及断裂模式进行了分析。结果表明

随着时效时间的延长

一是界面IMC不断增厚

其生长动力学符合抛物线生长规律

时效温度越高IMC生长速率越大

激活能为90kJ/mol;二是互联焊点的抗拉强度不断下降

其断裂模式由纯剪切断裂逐渐向微孔聚集型断裂转变。

Abstract

Growth of intermetallic compound of interface and tensile strength of Cu/Sn-3Ag-0.5Cu/Cu butting solder joints with aging treatment at 100

125

150 ℃ were investigated by SEM （scanning electron microscope）

EDS (energy dispersive spectrometer and mechanical testing. Fracture morphology and fracture mode of the solder joint were evaluated. The results show that with increasing in aging time

thickness of interfacial IMC is increased

and its growth dynamics is accordant with parabolic law. The growth rate is accelerated with increasing in aging temperature

and activation energy reaches 90 kJ/mol. In addition

with increasing in aging time

tensile strength of the solder joint is decreased

and the fracture mechanism is transformed from pure shearing mode to micro-void accumulation one.