The microstructure and related properties of the high strength and high conductivity tungsten copper alloy which was prepared by loose-packing and infiltration method with the average tungsten granularity of 50 nm and 7 μm as well as 99.9% purity were investigated.The results show that the high strength and high conductivity Cu-W alloy can be prepared by loose-packing and infiltration method.With the decrease of W powder size

the alloy is improved increasingly in the sintering behavior

density

hardness and strength.However

with the powder granularity reaching to nanometer grade

microstructure uniformity of the alloy is decreased as a result of the segregation of copper phase.The porosity of the loose-packing W powder is increased with decreasing in average diameter of powder granularity.The tensile strength

electric conductivity

hardness and Cu content of the alloy prepared with 7 μm W powder reach 370 MPa

43.34 μΩ-1·m-1

80.4 and 65%

respectively

and those of the alloy prepared with 50 nm reach 410 MPa

37.07 μΩ-1·m-1

112

73%

respectively.