Molecular Dynamics Simulation of Wetting Behavior of Flux and Aluminum Melt

Sun Zetang; Fu Gaosheng; Wang Huosheng; Chen Hongling; Song Lili

doi:10.15980/j.tzzz.2022.10.009

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Molecular Dynamics Simulation of Wetting Behavior of Flux and Aluminum Melt
Vol. 42, Issue 10, Pages: 1236-1241(2022)
Published： 2022 ，
DOI： 10.15980/j.tzzz.2022.10.009

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Sun Zetang, Fu Gaosheng, Wang Huosheng, et al. Molecular Dynamics Simulation of Wetting Behavior of Flux and Aluminum Melt. [J]. Special Casting & Nonferrous Alloys 42(10):1236-1241(2022)
DOI：

Sun Zetang, Fu Gaosheng, Wang Huosheng, et al. Molecular Dynamics Simulation of Wetting Behavior of Flux and Aluminum Melt. [J]. Special Casting & Nonferrous Alloys 42(10):1236-1241(2022) DOI： 10.15980/j.tzzz.2022.10.009.

摘要

采用分子动力学模拟技术对铝熔体中熔剂与铝熔体及氧化铝的润湿行为进行研究，验证了等摩尔比(NaCl+KCl)(85%)+Na

AlF

(7.8%)+AlF

(5.7%)+CaF

(1.5%)熔剂为最优排杂熔剂组成，并通过A356铝屑在熔化过程的聚集情况做进一步验证。结果表明，该熔剂与Al

的润湿性较好，与铝熔体的润湿性较差，且熔解氧化膜的能力较强，有利于排杂。

Abstract

Molecular dynamics simulation method was carried out to investigate the wetting behavior of flux with aluminum melt and Al

in aluminum melt. The rationality of equimolar（NaCl+KCl）（85%）+Na

AlF

（7.8%）+AlF

（5.7%）+CaF

（1.5%） flux as the optimum flux composition was verified

and the aggregation of A356 aluminum chips during the melting process was further verified. The results indicate that the flux has desirable wettability with Al

which is poor with aluminum melt. The ability to melt the oxide film is strong

which is favorable for the discharge.