Effects of aging temperature and duration on the strength

electrical conductivity and microstructure of Cu-1.7 Ni-0.5 Be alloy were investigated by OM

SEM

EDS and tensile testing. The results indicate that the comprehensive performance of Cu-1.7 Ni-0.5 Be alloy is desirable after solid solution at 920 ℃ for 1 h and aged at 480 ℃ for 6 h

where the electrical conductivity

tensile strength and elongation reach 34.278 MS/m

758 MPa and 21%

respectively. In the range of 0.25～10 h

absence of precipitated phase is observed at the beginning of aging

and the alloy strengthening is dominated by the G.P. region. With the increase of aging time

the precipitated phase is generated gradually and exhibits dispersed distribution. When aging for 10 h

the precipitation at 510 ℃ is coarser than that of ones at 480 ℃. Under the aging temperature of 450～510 ℃

the tensile strength is increased at first and then decreased with the increase of aging time on the whole. The peak time of the alloy at 450 ℃

480 ℃ and 510 ℃ are 8 h

6 h and 2 h

respectively. The higher the aging temperature is

the earlier the peak value appears. With the increase of aging time

the electrical conductivity is increased gradually with a slower rate. The main fracture mode is dominated by ductile fracture under normal temperature stretch.