Electromigration Behavior of Cu/Sn-58Bi/Cu Solder Joints

Liu Shengfa; Tan Yingzhen; Song Tianjie; Liu Li; Liu Zhangyang; San Zhanyi; Huang Shangyu

doi:10.15980/j.tzzz.2020.01.002

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Electromigration Behavior of Cu/Sn-58Bi/Cu Solder Joints
Vol. 40, Issue 1, Pages: 7-11(2020)
Published： 2020 ，
DOI： 10.15980/j.tzzz.2020.01.002

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[1]刘生发,谭颖臻,宋天杰,刘俐,刘张扬,散展翼,黄尚宇.Cu/Sn-58Bi/Cu焊点电迁移行为研究[J].特种铸造及有色合金,2020,40(01):7-11.

Liu Shengfa, Tan Yingzhen, Song Tianjie, et al. Electromigration Behavior of Cu/Sn-58Bi/Cu Solder Joints. [J]. Special Casting & Nonferrous Alloys 40(1):7-11(2020)
[1]刘生发,谭颖臻,宋天杰,刘俐,刘张扬,散展翼,黄尚宇.Cu/Sn-58Bi/Cu焊点电迁移行为研究[J].特种铸造及有色合金,2020,40(01):7-11. DOI： 10.15980/j.tzzz.2020.01.002.

Liu Shengfa, Tan Yingzhen, Song Tianjie, et al. Electromigration Behavior of Cu/Sn-58Bi/Cu Solder Joints. [J]. Special Casting & Nonferrous Alloys 40(1):7-11(2020) DOI： 10.15980/j.tzzz.2020.01.002.

摘要

采用双辊快速凝固技术制备了Sn-58Bi钎料薄带

并制备Cu/Sn-58Bi/Cu线性焊点。使用电子探针（EPMA）及能谱分析（EDS）研究焊点在电流密度为1×10

A/cm

（25℃）下界面金属间化合物（IMC）、元素扩散与钎料基体组织演变规律。结果表明

随着通电时间延长阳极界面处的IMC层的形状从扇贝状转变为锯齿状

阴极界面处的IMC层由扇贝形变为不规则

其厚度逐渐增加。阳极由于Bi的偏聚形成了富Bi层

Sn在阴极偏聚

基体共晶组织（Bi+β-Sn）粗化。基于线性拟合可知

阳极和阴极的界面IMC层的生长系数n分别为0.263和0.442

其生长机制可归结为体积扩散。

Abstract

The Sn-58 Bi solder ribbon was prepared by the twin-roll rapid solidification technique

and the Cu/Sn-58 Bi/Cu linear solder joints were prepared.The interface IMC

element diffusion and microstructure evolution of solder joints were analyzed by EPMA and EDS after the current density of 1×10

A/cm

（25 ℃）.The results reveal that the morphology of the anode IMC layer is changed from scallop shape to zigzag shape

and the cathode IMC layer is changed from scallop shape to irregular one with the increase of thickness gradually.Bi is segregated toward the anode to form a Bi-rich layer

and Sn is segregated at the cathode.And the matrix eutectic structure（Bi+β-Sn）is coarsened.Based on linear fitting

the growth coefficient n of IMC layer of the anode and cathode are 0.263 and 0.442

respectively

and the growth mechanism is attributed to volume diffusion.