Effects of Cu Content on Microstructure and Thermal Conductivity of Al-12Si Alloy

Sheng Xiaodong; Weng Wenping; Yang Lei; Fan Weizhong; Hiromi Nagaumi; Chen Xiaocun

doi:10.15980/j.tzzz.2019.01.024

Views : 0 下载量: 126 CSCD: 2

Export
Share
Collection
Album

Effects of Cu Content on Microstructure and Thermal Conductivity of Al-12Si Alloy
Vol. 39, Issue 1, Pages: 87-90(2019)
Published： 2019 ，
DOI： 10.15980/j.tzzz.2019.01.024

扫描看全文

[1]沈晓东,翁文凭,杨蕾,范卫忠,长海博文,陈小村.Cu含量对Al-12Si合金组织结构及导热性能的影响[J].特种铸造及有色合金,2019,39(01):87-90.

Sheng Xiaodong, Weng Wenping, Yang Lei, et al. Effects of Cu Content on Microstructure and Thermal Conductivity of Al-12Si Alloy. [J]. Special Casting & Nonferrous Alloys 39(1):87-90(2019)
[1]沈晓东,翁文凭,杨蕾,范卫忠,长海博文,陈小村.Cu含量对Al-12Si合金组织结构及导热性能的影响[J].特种铸造及有色合金,2019,39(01):87-90. DOI： 10.15980/j.tzzz.2019.01.024.

Sheng Xiaodong, Weng Wenping, Yang Lei, et al. Effects of Cu Content on Microstructure and Thermal Conductivity of Al-12Si Alloy. [J]. Special Casting & Nonferrous Alloys 39(1):87-90(2019) DOI： 10.15980/j.tzzz.2019.01.024.

摘要

采用熔铸工艺制备了不同Cu含量（0.03%～4.2%）的Al-12Si-xCu-0.6Mg合金试样

分析Cu含量对Al-Si合金组织结构、力学性能与导热性能的影响。结果表明

随着Cu含量从0.03%增加到4.2%

Al-12Si-xCu-0.6Mg合金强度由212.3 MPa提高到285.3MPa

但热导率由152W/（m·K）降低到119W/（m·K）。另外

随着Cu含量增加

合金中初生α-Al相明显细化

从发达树枝晶向细小圆整等轴晶转化

共晶Si相晶粒尺寸逐渐增大;分散的块状α-Al相会造成电子传导通道的断裂

粗大的共晶Si提高电子运动过程中的散射概率

降低自由电子的平均自由程

从而导致合金导热性能下降。

Abstract

The Al-12 Si alloys with different Cu contents were prepared by metal mold casting.The effects of Cu on the mechanical properties and thermal conductivity of Al-12Si-xCu-0.6Mg alloys were investigated.The results reveal that the mechanical properties are enhanced greatly as the Cu content increase.With the increase of Cu content

the strength of Al-12Si-xCu-0.6Mg alloy is increased from 212.3MPa to 285.3MPa

while the thermal conductivity is decreased from 152W/（m·K）to 119W/（m·K）.Microscopic analysis reveals that with the Cu content increase

α-Al is refined gradually from the developed dendrite to fine equiaxed grain and eutectic Si phase is coarsened.The dispersed blockα-Al cause the fracture of the electronic thermal conduction channel of the alloy

and the coarse eutectic Si can increase the scattering of electron conduction

resulting in a decrease of the thermal conductivity of the alloy.