Effects of Annealing Temperature on the Interface Microstructures and Properties of Cu-Al Clad Plates

Liu Yazhou; Wang Wenyan; Huang Yabo; Liu Jiyao; Guo Leiming; Xie Jingpei; Zhao Xuanwei

doi:10.15980/j.tzzz.2018.11.018

Views : 0 下载量: 158 CSCD: 2

Export
Share
Collection
Album

Effects of Annealing Temperature on the Interface Microstructures and Properties of Cu-Al Clad Plates
Vol. 38, Issue 11, Pages: 1230-1233(2018)
Published： 2018 ，
DOI： 10.15980/j.tzzz.2018.11.018

扫描看全文

[1]刘亚洲,王文焱,黄亚博,刘冀尧,郭雷明,谢敬佩,赵轩玮.退火温度对铜-铝复合板界面组织及性能的影响[J].特种铸造及有色合金,2018,38(11):1230-1233.

Liu Yazhou, Wang Wenyan, Huang Yabo, et al. Effects of Annealing Temperature on the Interface Microstructures and Properties of Cu-Al Clad Plates. [J]. Special Casting & Nonferrous Alloys 38(11):1230-1233(2018)
[1]刘亚洲,王文焱,黄亚博,刘冀尧,郭雷明,谢敬佩,赵轩玮.退火温度对铜-铝复合板界面组织及性能的影响[J].特种铸造及有色合金,2018,38(11):1230-1233. DOI： 10.15980/j.tzzz.2018.11.018.

Liu Yazhou, Wang Wenyan, Huang Yabo, et al. Effects of Annealing Temperature on the Interface Microstructures and Properties of Cu-Al Clad Plates. [J]. Special Casting & Nonferrous Alloys 38(11):1230-1233(2018) DOI： 10.15980/j.tzzz.2018.11.018.

摘要

采用铸轧法制备8mm厚层状Cu-Al复合板

通过SEM、XRD和TEM等手段研究不同退火温度对Cu-Al复合板界面组织变化的影响

利用拉伸试验和显微硬度表征复合板的力学性能。结果表明

随着退火温度升高

界面层厚度由1μm增加到11μm

400℃时界面呈现出三层结构;退火温度升高

Cu、Al原子扩散加剧

界面物相种类增多。250℃时界面仅有CuAl

相生成

300℃时界面生成新相Cu

450℃时界面有CuAl相生成。界面物相种类和厚度变化导致界面剥离强度先升后降

在300℃时达到最大值42N·mm

-1

。试验分析表明

铸轧成形8mm厚Cu-Al复合板最佳退火温度为300℃。

Abstract

Using scanning electrical microscope（SEM）

X-ray diffraction（XRD）and energy dispersive spectrometer（EDS）

the effects of annealing temperatures on the microstructure of Cu-Al clad plate produced by roll-casting technology were investigated.And the mechanical properties of the composite plate were characterized by tensile tests and micro-hardness tests.The results show that the thickness of interface layer is increased from 1μm to 11μm with the increase of annealing temperature and the interface layer includes three sub-layers at 400℃.The diffusion of atoms and the kinds of phases at interface are increased as the annealing temperature increase.The CuAl

phase at the interface is firstly formed at 250℃

followed by Cu

at 300℃

then CuAl phase is formed at 450℃.The peeling strength of the interface is increased firstly and then decreased due to the change of phases and their thickness

and reaches a maximum value of 42N·mm

-1

at 300℃.According to experimental results

the optimal annealing temperature for Cu/Al clad plates produced by roll-casting is 300℃.