The Research Development of Cu-Ni-Si Lead Frame Materials for Mobile Phone Fast Charging Connector

Pang Shengqian; Li Xiaohua

doi:10.15980/j.tzzz.2017.10.030

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The Research Development of Cu-Ni-Si Lead Frame Materials for Mobile Phone Fast Charging Connector
Vol. 37, Issue 10, Pages: 1154-1157(2017)
Published： 2017 ，
DOI： 10.15980/j.tzzz.2017.10.030

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[1]庞胜乾,黎晓华.手机快充端子铜镍硅引线框架材料研究进展[J].特种铸造及有色合金,2017,37(10):1154-1157.

Pang Shengqian, Li Xiaohua. The Research Development of Cu-Ni-Si Lead Frame Materials for Mobile Phone Fast Charging Connector. [J]. Special Casting & Nonferrous Alloys 37(10):1154-1157(2017)
[1]庞胜乾,黎晓华.手机快充端子铜镍硅引线框架材料研究进展[J].特种铸造及有色合金,2017,37(10):1154-1157. DOI： 10.15980/j.tzzz.2017.10.030.

Pang Shengqian, Li Xiaohua. The Research Development of Cu-Ni-Si Lead Frame Materials for Mobile Phone Fast Charging Connector. [J]. Special Casting & Nonferrous Alloys 37(10):1154-1157(2017) DOI： 10.15980/j.tzzz.2017.10.030.

摘要

简述了手机的快充模式与应用

综述引线框架的材料发展。对比了几种常见手机快充端子引线框架材料的力学性能和导电导热性能。介绍了Cu-Ni-Si合金的研究情况

结合主流手机充电端子的设计思路探讨可能发生的失效模式和产生原因

为提高手机Cu-Ni-Si引线框架的品质提出措施。

Abstract

The charging mode and technology application of mobile phone fast charging were described

and development of lead frame material was reviewed.The tensile strength

thermal conductivity

electrical conductivity and thermal expansion coefficient of lead frame materials for mobile phone fast charging connector were analyzed comparatively.The progress of Cu-Ni-Si series alloy was introduced.The possible failure modes and origination were discussed according to the design of the main mobile phone fast charging connector

and the countermeasures were proposed to improve the quality of Cu-Ni-Si lead frame for mobile phone.

关键词

手机快充端子引线框架材料铜镍硅合金失效模式

Keywords

Mobile Phone Fast ChargingConnectorlead FrameCu-Ni-Si AlloyFailure Modes

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