The compression experiments of semi-solid ZCu Sn10 copper alloy billets were performed by using the Gleeble-1500 thermal mechanical simulator. The effects of compression conditions on the deformation behavior and microstructure evolution of the semi-solid ZCu Sn10 copper alloy billets were investigated. The experimental results reveal that the dendrite sample is difficult to be deformed because of its dendrite. The copper alloy with non-dendrite structure has the lower loading compared with the as-cast samples. The load-displacement curves are affected by temperature seriously. The load is increased with the increase of displacement

and the higher temperature leads to the higher liquid fraction and the lower loading

while the higher deformation rate leads to the higher loading under the same displacement. The microstructure is changed continuously during compression process. Within a certain range

a higher compression rate and temperature are beneficial for the collaborative flow of solid and liquid phase.