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    • Effect of Ultrasonic Vibration Assisted Pouring on Microstructure and Properties of the Low Temperature Soldering Alloy for Electronic Components

    • Vol. 36, Issue 4, Pages: 357-360(2016)   

      Published: 2016 ,

    • DOI: 10.15980/j.tzzz.2016.04.006     

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  • Ye Jianmei, Liu Huimin, Deng Lixia. Effect of Ultrasonic Vibration Assisted Pouring on Microstructure and Properties of the Low Temperature Soldering Alloy for Electronic Components. [J]. Special Casting & Nonferrous Alloys 36(4):357-360(2016) DOI: 10.15980/j.tzzz.2016.04.006.
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相关作者

郑强 中南大学
刘红卫 中南大学
黄兰萍 中南大学
陈康华 中南大学
Hu Huawen Chen Kanghua Huang Lanping Liu Hongwei Zheng Qiang 中南大学
Guo Feng   南昌大学机电工程学院  
Gao Ting   南昌大学机电工程学院  
Li Ke   南昌大学机电工程学院  

相关机构

Central south University
School of Mechanical and Electrical Engineering,Nanchang University
Shaanxi Key Laboratory of Condensed Matter Structures and Properties, Northwestern Polytechnical University
State Key Laboratory for Material Forming & Mould Technology, Huazhong University of Science and Technology
School of Materials Science and Engineering, Beihang University
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