Microstructure and Properties of Cu-50Mo Contact Materials Prepared by Spark Plasma Sintering Process

Shang Xinfeng

doi:10.15980/j.tzzz.2015.11.030

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Microstructure and Properties of Cu-50Mo Contact Materials Prepared by Spark Plasma Sintering Process
Vol. 35, Issue 11, Pages: 1230-1232(2015)
Published： 2015 ，
DOI： 10.15980/j.tzzz.2015.11.030

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[1]尚新峰.SPS制备Cu-50Mo触头材料的研究[J].特种铸造及有色合金,2015,35(11):1230-1232.

Shang Xinfeng. Microstructure and Properties of Cu-50Mo Contact Materials Prepared by Spark Plasma Sintering Process. [J]. Special Casting & Nonferrous Alloys 35(11):1230-1232(2015)
[1]尚新峰.SPS制备Cu-50Mo触头材料的研究[J].特种铸造及有色合金,2015,35(11):1230-1232. DOI： 10.15980/j.tzzz.2015.11.030.

Shang Xinfeng. Microstructure and Properties of Cu-50Mo Contact Materials Prepared by Spark Plasma Sintering Process. [J]. Special Casting & Nonferrous Alloys 35(11):1230-1232(2015) DOI： 10.15980/j.tzzz.2015.11.030.

摘要

采用放电等离子烧结（SPS）工艺在950℃、40 MPa下烧结20min后随炉冷却

制得Cu-50Mo触头合金材料。测试结果表明

显微硬度（HV）、电导率和致密度分别达到116、21.5 MS/m和92.5%

并对其组织和性能进行了研究

同时对比了1%的WC颗粒对Cu-50Mo合金触头材料组织性能的影响。结果表明

WC颗粒的加入能使Cu-50Mo触头材料的组织明显改善

显著提高耐磨性能显著提高。

Abstract

The Cu-50 Mo contact material was prepared by spark plasma sintering（SPS）at 950 ℃ and 45 MPa for 20 min.Microstructure and properties of the material were investigated

and the hardness

conductivity and density of the alloy reach up to 110 HV

21.5MS/m

92.5%

respectively.Furthermore

effects of 1% WC addition on the structure and properties of Cu-50 Mo alloy material were analyzed.The results indicate that structure and wear resistance of the Cu-50 Mo material were improved.