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    • Numerical Simulation of Thermoelectromagnetic Convection During Direction Solidification of Polysilicon

    • Vol. 34, Issue 9, Pages: 899-902(2014)   

      Published: 2014 ,

    • DOI: 10.15980/j.tzzz.2014.09.041     

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  • Luo Yufeng, Song Huawei, Zhang Fayun, et al. Numerical Simulation of Thermoelectromagnetic Convection During Direction Solidification of Polysilicon. [J]. Special Casting & Nonferrous Alloys 34(9):899-902(2014) DOI: 10.15980/j.tzzz.2014.09.041.
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相关机构

School of Materials Science and Engineering, Henan Polytechnic University
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