Electrical Conductivity of Ceramic Particles Reinforced Copper-matrix Composites

Guo Xiuhua; Song Kexing; Wang Xu; Zhao Peifeng; Zhang Yanmin

doi:10.15980/j.tzzz.2013.11.004

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Electrical Conductivity of Ceramic Particles Reinforced Copper-matrix Composites
Vol. 33, Issue 11, Pages: 992-995(2013)
Published： 2013 ，
DOI： 10.15980/j.tzzz.2013.11.004

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[1]国秀花,宋克兴,王旭,赵培峰,张彦敏.颗粒增强Cu基复合材料的导电性[J].特种铸造及有色合金,2013,33(11):992-995.

Guo Xiuhua, Song Kexing, Wang Xu, et al. Electrical Conductivity of Ceramic Particles Reinforced Copper-matrix Composites. [J]. Special Casting & Nonferrous Alloys 33(11):992-995(2013)
[1]国秀花,宋克兴,王旭,赵培峰,张彦敏.颗粒增强Cu基复合材料的导电性[J].特种铸造及有色合金,2013,33(11):992-995. DOI： 10.15980/j.tzzz.2013.11.004.

Guo Xiuhua, Song Kexing, Wang Xu, et al. Electrical Conductivity of Ceramic Particles Reinforced Copper-matrix Composites. [J]. Special Casting & Nonferrous Alloys 33(11):992-995(2013) DOI： 10.15980/j.tzzz.2013.11.004.

摘要

采用内氧化工艺和粉末冶金制备了不同体积分数和不同增强相的Cu基复合材料

测试了Cu基复合材料的导电性能。结果表明

内氧化工艺制备的Al2O3/Cu复合材料的电导率和密度均高于粉末冶金工艺制备的Al2O3/Cu复合材料

且复合材料的电导率和密度随Al2O3颗粒增强相含量的增加而降低;另外

Cu基复合材料的电导率随颗粒-基体的热膨胀系数差值的增大而降低。微观组织观察表明

界面结合状态与复合材料的电导率密切相关。内氧化法制备的Al2O3/Cu复合材料比粉末冶金法制备的Al2O3/Cu复合材料晶界排列更整齐致密。

Abstract

The copper-matrix composites reinforced with different nano-particles of Al2O3

SiO2

SiC and MgO in varied volumetric fraction were fabricated by internal oxidation and by powder metallurgy.The effects of preparation technology、volumetric fraction of reinforcements and thermal expansion coefficient difference between copper-matrix and reinforced particles on the electrical conductivity of the copper-matrix composites prepared were investigated.The results show that the electrical conductivity and density of Al2O3/Cu composite fabricated by internal oxidation which are increased with decreasing in Al2O3volume fraction are higher than those by powder metallurgy.The electrical conductivity of Al2O3/Cu composites is reduced with the increase of thermal expansion coefficient difference between copper-matrix and reinforced particles

which is relative with the values of calculation of the thermal stress at the copper matrix/reinforcement interface.Microstructure observation shows that the fine Al2O3particles are distributed more uniformly with alignment in the Al2O3/Cu composites fabricated by internal oxidation compared with that by powder metallurgy.